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Copyright © DYNAMIC MOS TECHNOLOGY
CO., LTD.All Rights Reserved.
Dynamic MOS Technology’s
Equipment
PACKAGING ASSEMBLY
ATE
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PACKAGING ASSEMBLY
項目
狀態
更新日期
數量
1
Takatori ATRM-2200G tape delaminator 1 set
SOLD
2024-09-03 09:32:58
1
2
1*45' container of semicondcutor equipment
SOLD
2024-08-30 16:07:49
1 lot
3
DISCO DFL7340 laser stealth saw, OKK auto wafer expander total 2 sets
SOLD
2024-08-30 15:33:14
3
4
K&S IConn wire bonder 2 sets, Maxum Ultra wire bonder 7 sets
SOLD
2024-08-30 15:25:33
9
5
3x 40' HQ, ASM die boner wire bonder
SOLD
2024-08-08 11:44:47
1lot
6
ASM IDEAL mold 120T 1set, ISLinDA AD8912SD die bonder 4 sets
SOLD
2024-08-08 11:31:55
5
7
Besi Datacon 2200evo die bonder 1 set
SOLD
2024-07-01 16:41:20
1
8
DISCO DFD6341 wafer saw 2 sets
SOLD
2024-07-01 16:15:56
2
9
ASM AMICRA NANO Flip-chip Die Bonder 1x
SOLD
2024-06-21 14:21:58
1
10
40'x 6 plus 20' x 1 total 7 containers of semicondcutor equipment.
SOLD
2024-06-13 14:22:50
1 lot
11
ASM AD838 die bonder 1 set
SOLD
2024-05-22 15:34:44
1
12
YAMADA G-LINE Auto molding system 1 set
SOLD
2024-04-26 15:59:13
1
13
RENESAS HITACHI DB700/DB700AC/DB700AD DIE BONDER 8 sets
SOLD
2024-04-02 11:38:19
8
14
DISCO EAD6750+HANMI 20000D saw/singulation/sorter system 1set
SOLD
2024-03-28 16:05:54
1
15
Shinkawa UTC-2000/UTC-2000super wire bonder 80sets
SOLD
2024-03-28 15:12:41
80
16
NITTO DR8500-II tape laminator 1 set
SOLD
2024-03-28 10:36:56
1
17
60 sets Semiconductor equipment, 7x 40'' plus 1x 20'' containers.
SOLD
2024-01-12 12:01:02
1 lot
18
K&S AT-PREMIER wafer level bonder
SOLD
2024-01-08 16:10:20
1
19
DISCO DGP8761+DFM2800 in-line 300mm wafer grinder
SOLD
2023-11-22 09:55:23
1
20
DISCO DFG841 Parts 1 lot.
SOLD
2023-11-10 11:05:05
1lot