Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1DISCO DFD6240, TSK Accretech A-WD-200T dicing saw 4 setsSOLD2024-10-14 09:59:384
- 2Hitachi/Renesas DB-730AC 300mm die bonder 4 setsSOLD2024-10-07 11:34:024
- 3BESI Datacon 8800Chameo flipchip bonderSOLD2024-09-30 09:33:491
- 4Takatori ATRM-2200G tape delaminator 1 setSOLD2024-09-03 09:32:581
- 51*45' container of semicondcutor equipmentSOLD2024-08-30 16:07:491 lot
- 6DISCO DFL7340 laser stealth saw, OKK auto wafer expander total 2 setsSOLD2024-08-30 15:33:143
- 7K&S IConn wire bonder 2 sets, Maxum Ultra wire bonder 7 setsSOLD2024-08-30 15:25:339
- 83x 40' HQ, ASM die boner wire bonderSOLD2024-08-08 11:44:471lot
- 9ASM IDEAL mold 120T 1set, ISLinDA AD8912SD die bonder 4 setsSOLD2024-08-08 11:31:555
- 10Besi Datacon 2200evo die bonder 1 setSOLD2024-07-01 16:41:201
- 11DISCO DFD6341 wafer saw 2 setsSOLD2024-07-01 16:15:562
- 12ASM AMICRA NANO Flip-chip Die Bonder 1xSOLD2024-06-21 14:21:581
- 1340'x 6 plus 20' x 1 total 7 containers of semicondcutor equipment.SOLD2024-06-13 14:22:501 lot
- 14ASM AD838 die bonder 1 setSOLD2024-05-22 15:34:441
- 15YAMADA G-LINE Auto molding system 1 setSOLD2024-04-26 15:59:131
- 16RENESAS HITACHI DB700/DB700AC/DB700AD DIE BONDER 8 setsSOLD2024-04-02 11:38:198
- 17DISCO EAD6750+HANMI 20000D saw/singulation/sorter system 1setSOLD2024-03-28 16:05:541
- 18Shinkawa UTC-2000/UTC-2000super wire bonder 80setsSOLD2024-03-28 15:12:4180
- 19NITTO DR8500-II tape laminator 1 setSOLD2024-03-28 10:36:561
- 2060 sets Semiconductor equipment, 7x 40'' plus 1x 20'' containers.SOLD2024-01-12 12:01:021 lot