Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1DISCO DFG8560 300mm wafer backside grinder 2 sets plus DGP8761 wafer backside grinder/polisher 1 setSOLD2025-02-13 11:38:561 lot
- 2DISCO DFG8540 200mm wafer backside grinderSOLD2025-02-13 11:34:021
- 3DISCO DFD641 200mm wafer sawSOLD2025-02-05 17:03:251
- 4K&S IConn ProCu wire bonder 4 sets.SOLD2025-01-20 10:03:364
- 5STI TR48IV tape-reel systemSOLD2025-01-17 09:10:571
- 6DISCO DFD6362 300mm wafer dicing saw.SOLD2025-01-17 09:08:191
- 7YAMATO DKN402 oven 1 setSOLD2025-01-17 09:03:531
- 8Okamoto GNX200B wafer grinderSOLD2024-12-11 16:59:381
- 9Secron SW5000 with Disco EAD6340 saw & P/P systemSOLD2024-12-11 16:58:101 set
- 10ASM ISLinDA 300mm die bonder for CIS 2 setsSOLD2024-12-11 16:54:502
- 11DISCO DFD6240, TSK Accretech A-WD-200T dicing saw 4 setsSOLD2024-10-14 09:59:384
- 12Hitachi/Renesas DB-730AC 300mm die bonder 4 setsSOLD2024-10-07 11:34:024
- 13BESI Datacon 8800Chameo flipchip bonderSOLD2024-09-30 09:33:491
- 14Takatori ATRM-2200G tape delaminator 1 setSOLD2024-09-03 09:32:581
- 151*45' container of semicondcutor equipmentSOLD2024-08-30 16:07:491 lot
- 16DISCO DFL7340 laser stealth saw, OKK auto wafer expander total 2 setsSOLD2024-08-30 15:33:143
- 17K&S IConn wire bonder 2 sets, Maxum Ultra wire bonder 7 setsSOLD2024-08-30 15:25:339
- 183x 40' HQ, ASM die boner wire bonderSOLD2024-08-08 11:44:471lot
- 19ASM IDEAL mold 120T 1set, ISLinDA AD8912SD die bonder 4 setsSOLD2024-08-08 11:31:555
- 20Besi Datacon 2200evo die bonder 1 setSOLD2024-07-01 16:41:201