DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● SOLD / Hitachi Rensas DB-700AC Die Bonder 6 sets
- ● SOLD / Accretech TSK UF3000 300mm wafer prober 6 sets
- ● SOLD / DISCO DFG850 Wafer Grinder 1 set
- ● SOLD / SEIKO EPSON ND6040 high speed IC handler 4 sets
- ● SOLD / DISCO DAD3350 dicing saw 2 sets
- ● SOLD / Verigy V50 Tester 1 set
- ● SOLD / Verigy V50 Tester 2 sets
- ● SOLD / 1 lot of SMT equipment
- ● FOR SELL / ESEC 2008/ ESEC2100 die bonder bonding force calibraiton kit 50N
- ● FOR SELL / NIKON NSR-S210D KrF Scanner/KrF Stepper
- ● FOR SELL / Besi ESEC2100sD 300mm die bonder
- ● FOR SELL / LINTEC RAD-2510 F/12 Wafer Mounter 1 set, Vintage : 2026 New and unused
- ● WANTED / NITTO DR8500-II Tape Laminator 2 sets
- ● WANTED / K&S ConnX Elite Wire Bonder 5 set
- ● WANTED / ASM AD420 Die bonder 3 set
- ● WANTED / BESI ESEC2100 HS Die bonder 1 set
- ● WANTED / ASM iDeal Mold 2G 软件要更新到跟3G iDeal mold 一样版本
- ● WANTED / DISCO DGP8761+DFM2800 wafer grinder/polisher/mounter
- ● WANTED / Karl Suss FC150 Flip Chip Bonder 2 set
- ● WANTED / Teradyne NEXTEST Magnum 2 EV Tester 1 set
- ● SOLD / Hitachi Rensas DB-700AC Die Bonder 6 sets
- ● SOLD / Accretech TSK UF3000 300mm wafer prober 6 sets
- ● SOLD / DISCO DFG850 Wafer Grinder 1 set
- ● SOLD / SEIKO EPSON ND6040 high speed IC handler 4 sets
- ● SOLD / DISCO DAD3350 dicing saw 2 sets
- ● SOLD / Verigy V50 Tester 1 set
- ● SOLD / Verigy V50 Tester 2 sets
- ● SOLD / 1 lot of SMT equipment
- ● FOR SELL / ESEC 2008/ ESEC2100 die bonder bonding force calibraiton kit 50N
- ● FOR SELL / NIKON NSR-S210D KrF Scanner/KrF Stepper
- ● FOR SELL / Besi ESEC2100sD 300mm die bonder
- ● FOR SELL / LINTEC RAD-2510 F/12 Wafer Mounter 1 set, Vintage : 2026 New and unused
- ● WANTED / NITTO DR8500-II Tape Laminator 2 sets
- ● WANTED / K&S ConnX Elite Wire Bonder 5 set
- ● WANTED / ASM AD420 Die bonder 3 set
- ● WANTED / BESI ESEC2100 HS Die bonder 1 set
- ● WANTED / ASM iDeal Mold 2G 软件要更新到跟3G iDeal mold 一样版本
- ● WANTED / DISCO DGP8761+DFM2800 wafer grinder/polisher/mounter
- ● WANTED / Karl Suss FC150 Flip Chip Bonder 2 set
- ● WANTED / Teradyne NEXTEST Magnum 2 EV Tester 1 set


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
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