Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1Shipment, ASM iHawk Xtreme wire bonder & 防潮箱
- 2K&S IConn wire bonder 16 sets
- 3YAMAHA YG200 Wafer Mounter
- 4STI DURASPORT Tape and Reel System
- 5Shibuya sbm-230 Solder Ball Mounter
AUTO TEST EQUIPMENT
- 1ACCRETECH TSK UF3000LX wafer prober 3 set
- 2SYNAX SX11xx 12xx 14xx Handler
- 3Display Color Analyzer CA-310
- 4ADVANTEST V93000 MCB
- 5TSK UF3000/UF3000EXE + air cooling chuck
WAFER FABRICATION
- 1ULVAC ei-7k or ei-5k Batch-type High Vacuum Evaporation System Model: ei
- 2FSE E-Gun/Thermal Evaporator System (Model: FSE-EBS-900 / FU-20PEB-900)
- 3DIC eFlow Anti-Static Defoamer
- 4PLATO 740-720*350 Manual Grinding and Polishing Machine
- 5TEL Tactras Vigus LK2 LK3 plasma etching