Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1K&S AT-Premier plus wafer bonder
- 2DISCO DFD6361 300mm wafer saw
- 3HESSE BondjetT BJ939 heavy wedge wire bonder
- 4ASM AB383 wire bonder
- 5K&S Rapid wire bonder
AUTO TEST EQUIPMENT
- 1Accretech TSK UF2000 wafer prober
- 2Accretech TSK UF200R wafer prober
- 3AccoTest STS8200 tester
- 4KLA TENCOR ICOS CI-T130 component inspection system
- 5ISMECA NX16/NX116 bowl feed handler 7 sets
WAFER FABRICATION
- 1Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- 2Panasonic PSX307 plasma cleaner
- 3Panasonic PSX307 plasma cleaner
- 4ACCRETECH TOSEI W-GM-4200B wafer edge grinder
- 5FEI Strata DB235 Focused Ion-Beam Dual-Beam
SURFACE MOUNT TECHNOLOGY
- 1Assembleon AX501 chip shooter 3 sets
- 2KTG BTU Pyramax 125N Reflow Oven PHST-7C-DL
- 3Assembleon AX-501 (TPR) Mounter 5 sets / Universal GC-30 Mounter 1 set / YAMAHA YG200 Mounter 2 sets / YAMAHA YV100-XG Mounter 4 sets / YAMAHA YV100-X Mounter 1 set / FUJI NXT Mounter 1 set / DEK HORIZON API Printer 4 sets / DEK HORIZON 02I Printer 3 sets / DEK HONIZON 03iX Printer 1 set / TRI TR7006L SPI 1 set / CYBER SE300 ULTRA SPI 6 sets / Cyber FLEX AOI 2 sets / Cyber FLEX 12 AOI 1 set / TRI TR7500 AOI 1 set / TRI TR7500 SII AOI 1 set / Vitronics XPM2-820 Reflow 3 sets / Vitronics MR1243+ Reflow 3 sets
- 4Yamaha chip mounter / screen printer 7 sets
- 5PSA Nitrogen Generator( 4x of 60m3 & 1x of 40m3)