Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1ESEC2009SSI E die bonder
- 2Wanted Hesse BJ931 wedge bonder
- 3Okamoto GNX200 wafer back grinder
- 4Wanted DISCO DAD3350 dicing saw
- 5K&S AT-Premier wafer stub bump
AUTO TEST EQUIPMENT
- 1PENTAMASTER PM31 test handler 分选机
- 2PENTAMASTER PM52 test handler 分选机
- 3SPANDIX SX1300 测试机
- 4美达 AMIDA RTG-600A 测试机
- 5美达 AMIDA RTG-500A 测试机
WAFER FABRICATION
- 1WANTED Canon FPA5550iZ load port
- 2Wanted ZEISS Sigma300 FE-SEM
- 36 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 4Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- 5Panasonic PSX307 plasma cleaner