Dynamic MOS Technology’s
Equipment
LATEST NEWS
- 1ADVANTEST ND2 T6372 DDI Tester 4 sets / OKAMOTO GNX300 Wafer grinder, 2000 Vintage, 8/12 inch 1 set / SHINKAWA UTC-2000Super Wire bonder 11 sets / MIT CAERUS C320 / CAERUS C330 Die sorter 1 set each / SENSOFAR S neox 3D Surface Profiler 1 set / MITSHBISHI 605GTX Laser Drilling Machine 1 set / ADVANTEST M6741AD Tri temp handler 17 sets / ADVANTEST M6751AD Tri temp handler 6 sets.
- 2ADVANTEST T6372 ND2 DDI tester
- 3ADVANTEST T6373 ND3 DDI tester
- 4ONTO PrecisionWoRx VX4 PRVX4 Probe Card Analyzer
- 5DISCO DAD3350 dicing saw 2023 vintage
PACKAGING ASSEMBLY
- 1ADVANTEST ND2 T6372 DDI Tester 4 sets / OKAMOTO GNX300 Wafer grinder, 2000 Vintage, 8/12 inch 1 set / SHINKAWA UTC-2000Super Wire bonder 11 sets / MIT CAERUS C320 / CAERUS C330 Die sorter 1 set each / SENSOFAR S neox 3D Surface Profiler 1 set / MITSHBISHI 605GTX Laser Drilling Machine 1 set / ADVANTEST M6741AD Tri temp handler 17 sets / ADVANTEST M6751AD Tri temp handler 6 sets.
- 2DISCO DAD3350 dicing saw 2023 vintage
- 3K&S IConn plus wire bonder
- 4DISCO DFD6340 dicing saw 3 sets for bid
- 5TOWA Y1E 4120 auto molding system
AUTO TEST EQUIPMENT
- 1ADVANTEST T6372 ND2 DDI tester
- 2ADVANTEST T6373 ND3 DDI tester
- 3ONTO PrecisionWoRx VX4 PRVX4 Probe Card Analyzer
- 4SYNAX SX2400 tri-temperature P/P handler
- 5Advantest V93000 PS1600B ATH tester
WAFER FABRICATION
- 1WANTED Canon FPA5550iZ load port
- 2Wanted ZEISS Sigma300 FE-SEM
- 36 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 4Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- 5Panasonic PSX307 plasma cleaner