Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1FNK Delvotec 6400 Wire Bonder
- 2DISCO DFL7161 Laser grooving
- 3LINTC RAD-3500 F/12 Tape Detaper 2 sets
- 41 lot of Equipment
- 5Hitachi Rensas DB-700AC Die Bonder 6 sets
AUTO TEST EQUIPMENT
- 1Accretech TSK UF3000LX 300mm wafer prober
- 2Accretech TSK UF3000 300mm wafer prober 6 sets
- 3SEIKO EPSON ND6040 high speed IC handler 4 sets
- 4Verigy V50 Tester 1 set
- 5Verigy V50 Tester 2 sets
WAFER FABRICATION
- 1NIKON NSR-S210D KrF Scanner/KrF Stepper
- 2ULVAC ei-7k or ei-5k Batch-type High Vacuum Evaporation System Model: ei
- 3DIC eFlow Anti-Static Defoamer
- 4PLATO 740-720*350 Manual Grinding and Polishing Machine
- 5TEL Tactras Vigus LK2 LK3 plasma etching
SURFACE MOUNT TECHNOLOGY
- 11 lot of SMT equipment
- 2KLA ICOS T890 Automatic Optical Inspection (AOI) machine
- 3PANASONIC CM202-DS chip mounter
- 4KLA TENCOR ICOS T890 automatic optical inspection machine
- 5HELLER 1809 EXL
OTHERS
- 1ASM iDeal Mold 2G 软件要更新到跟3G iDeal mold 一样版本
- 2Nexcope Research Grade Upright Metallurgical Microscope NM900
- 3OPTORUN OTFC-1300 or OTFC-1550 Optical Thin Film Coater
- 4Hirata Industrial Robot AR-W180CL-4-T-330-M-AX4
- 5FE-SEM: HITACHI S-4800, or JEOL JSM-7001F/7100F, or FEI (Thermo Fisher) Sirion/Magellan