Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1ESPEC EHS431 HAST
- 2BESI FICO AMS-LM auto molding system
- 3EO BMC204P laser driller for POP
- 4精映科技 Avvatech HERMES EC230E C02 bubbler
- 5MRSI HVM high volume die bonder
AUTO TEST EQUIPMENT
- 1Thermo Fisher MK.2TE ESD and Latch-up Test System
- 2APPLIED PRECISION / RUDOLPH PRVX3 Probe card analyzer
- 3Protec ZEUS dispenser
- 4Advantest T5503HS memory tester
- 5Techwing TW322XM test handler 2 sets
WAFER FABRICATION
- 1Nuflare EBM-8000P/M Variable EB Mask Writer system
- 2WANTED Canon FPA5550iZ load port
- 3Wanted ZEISS Sigma300 FE-SEM
- 46 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 5Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets