Dynamic MOS Technology’s
Equipment
LATEST NEWS
- 1DISCO DFL7161 Dicing Saw / DISCO 6000 grit grinding wheel 2 ea GF13-SD6000-V696-50 300X3WX7T-SR / TSK UF300A Wafer Prober 5 sets / ASM AD896-IL08 Die Bonder 1 set / K&S PowerFusion Al Wire Bonder / DISCO DAD3350 DAD3351 DAD3241 Dicing Saw / DATACON 2200apm Die Bonder / FICO Auto Mold System parts
- 2OXFORD RIE Plasma Plus 80 1 set / ASM Sunbird Inspection System 1 set / Mi Equipment Mi40 Handler 2 set / CASCADE PM300 Wafer Prober 1 set / DAGE4300 bond tester 1 set / RUDOLPH WS3840 3D Bump Metrology 1 set / HAD Wafermate300 Wafer Transfer machine 1 set / LINTEC RAD-2700 F12 Tape Laminator 1 set / NITTO MA3000-II MA3000-III Wafer Mounter 1 set / Fuji XP142E Wafer Mounter 7 set XP143E Wafer Mounter 1 set
- 3SEIKO EPSON NS-8040 high speed P/P handler
- 4BESI Datacon8800FC Quantum flipchip bonder
- 51x40' semiconductor equipment
PACKAGING ASSEMBLY
- 1DISCO DFL7161 Dicing Saw / DISCO 6000 grit grinding wheel 2 ea GF13-SD6000-V696-50 300X3WX7T-SR / TSK UF300A Wafer Prober 5 sets / ASM AD896-IL08 Die Bonder 1 set / K&S PowerFusion Al Wire Bonder / DISCO DAD3350 DAD3351 DAD3241 Dicing Saw / DATACON 2200apm Die Bonder / FICO Auto Mold System parts
- 2BESI Datacon8800FC Quantum flipchip bonder
- 31x40' semiconductor equipment
- 4DISCO DGP8761+DFM2800 300mm inline wafer grinder
- 5CANNON PLA-501FA Aligner 4 set ( 2000 Year ) / DISCO DAD320 DICING SAW ( 1995 Year ) / DISCO DAD520 DICING SAW ( 1994 Year ) / DISCO DAD521 DICING SAW ( 1996 Year ) / DISCO DAD522 DICING SAW ( 2001 Year ) / DISCO DCS141 Automatic Cleaning System
AUTO TEST EQUIPMENT
- 1OXFORD RIE Plasma Plus 80 1 set / ASM Sunbird Inspection System 1 set / Mi Equipment Mi40 Handler 2 set / CASCADE PM300 Wafer Prober 1 set / DAGE4300 bond tester 1 set / RUDOLPH WS3840 3D Bump Metrology 1 set / HAD Wafermate300 Wafer Transfer machine 1 set / LINTEC RAD-2700 F12 Tape Laminator 1 set / NITTO MA3000-II MA3000-III Wafer Mounter 1 set / Fuji XP142E Wafer Mounter 7 set XP143E Wafer Mounter 1 set
- 2SEIKO EPSON NS-8040 high speed P/P handler
- 3ADVANTEST T2000 Tester 5 sets / SEMICS OPUS3 Wafer Prober 1 set, 93K Docking, with APC / SEMICS OPUS3 SLT Wafer Prober 2 sets, with APC/Chiller / TEL PRECIO Wafer Prober V93K DD Pre-cold with APC 1 set / TEL P-12XLn+ Wafer Prober with APC 1 set / NIKON NWL8600+ECLIPSE L300 microscope 1 set
- 4TSK UF200 Wafer Prober 9 sets / TSK UF200S Wafer Prober 7 sets / TSK UF200A Wafer Prober 1 set / TSK UF200SA Wafer Prober 1 set
- 5CHROMA 3380P Tester 4 sets / TSK UF200 wafer prober 4 sets / TSK UF200SA wafer prober 1 set / TSK A-PM-90A wafer prober 3 sets
WAFER FABRICATION
- 1AIXTRON CCS CRIUS MOCVD 1 set
- 2Looking for CELLO Ohmiker-60B Evaporator
- 3VEECO K465i MOCVD 2 sets (offer before 1/9 5:00PM if interested)
- 4SAMCO RIE-212IPC Etchers 6 sets / SAMCO RIE-330IPC Etchers 1 set / SAMCO PD-4800 PECVD System 2 sets
- 512 inch wafer fabrication eqipment list
SURFACE MOUNT TECHNOLOGY
- 1Assembleon AX-501 (TPR) Mounter 5 sets / Universal GC-30 Mounter 1 set / YAMAHA YG200 Mounter 2 sets / YAMAHA YV100-XG Mounter 4 sets / YAMAHA YV100-X Mounter 1 set / FUJI NXT Mounter 1 set / DEK HORIZON API Printer 4 sets / DEK HORIZON 02I Printer 3 sets / DEK HONIZON 03iX Printer 1 set / TRI TR7006L SPI 1 set / CYBER SE300 ULTRA SPI 6 sets / Cyber FLEX AOI 2 sets / Cyber FLEX 12 AOI 1 set / TRI TR7500 AOI 1 set / TRI TR7500 SII AOI 1 set / Vitronics XPM2-820 Reflow 3 sets / Vitronics MR1243+ Reflow 3 sets
- 2Yamaha chip mounter / screen printer 7 sets
- 3PSA Nitrogen Generator( 4x of 60m3 & 1x of 40m3)
- 4Accord 400 Cleaner 1 set
- 5Fuji XP142/XP143/XPF-S chip mounter 6 sets