Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1DISCO DFG841 wafer back grinder
- 2TOWA FMS3040 jig saw 1 set
- 3NIKON OLYMPUS microscope 3 sets
- 4Takatori ATM-1100EF tape laminator 2 sets
- 5ASM AB838L die bonder
AUTO TEST EQUIPMENT
- 1Accretech TSK UF2000 wafer prober
- 2manual test station for down grade flash device 80 sets
- 3MUHLBAUER DS-20000 Die sorter
- 4NIKON NWL860+L200 microscope with auto loader
- 5table top microscope 38 sets
WAFER FABRICATION
- 1FEI Strata DB235 Focused Ion-Beam Dual-Beam
- 2HITACHI S-4700 FE-SEM
- 3SENSOFAR S ONIX 3D profile 量測儀
- 4Camtek Falcon 630plus 2D 3D metrology and inspection
- 5AIXTRON CCS CRIUS MOCVD 1 set
SURFACE MOUNT TECHNOLOGY
- 1Assembleon AX501 chip shooter 3 sets
- 2KTG BTU Pyramax 125N Reflow Oven PHST-7C-DL
- 3Assembleon AX-501 (TPR) Mounter 5 sets / Universal GC-30 Mounter 1 set / YAMAHA YG200 Mounter 2 sets / YAMAHA YV100-XG Mounter 4 sets / YAMAHA YV100-X Mounter 1 set / FUJI NXT Mounter 1 set / DEK HORIZON API Printer 4 sets / DEK HORIZON 02I Printer 3 sets / DEK HONIZON 03iX Printer 1 set / TRI TR7006L SPI 1 set / CYBER SE300 ULTRA SPI 6 sets / Cyber FLEX AOI 2 sets / Cyber FLEX 12 AOI 1 set / TRI TR7500 AOI 1 set / TRI TR7500 SII AOI 1 set / Vitronics XPM2-820 Reflow 3 sets / Vitronics MR1243+ Reflow 3 sets
- 4Yamaha chip mounter / screen printer 7 sets
- 5PSA Nitrogen Generator( 4x of 60m3 & 1x of 40m3)