Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1Panasonic PSX307-M Plasma (M type, large chamber)
- 2DISCO DAD3350 Dicing Saw 2 sets
- 3DISCO DFD6361 Dicing Saw 2 sets
- 4DISCO DGP8760+DFM2700 Wafer grinding / polishing / mounting machine
- 5MITSHBISHI 605GTX Laser Drilling Machine 1 set
AUTO TEST EQUIPMENT
- 1ADVANTEST M6751AD Tri temp handler 6 sets
- 2ADVANTEST M6741AD Tri temp handler 17 sets
- 3MIT CAERUS C320 / CAERUS C330 Die sorter 1 set each
- 4SENSOFAR S neox 3D Surface Profiler 1 set
- 5ADVANTEST ND2 T6372 DDI Tester 4
WAFER FABRICATION
- 1WANTED Canon FPA5550iZ load port
- 2Wanted ZEISS Sigma300 FE-SEM
- 36 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 4Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- 5Panasonic PSX307 plasma cleaner