Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1ESEC 2008/ ESEC2100 die bonder bonding force calibraiton kit 50N
- 2Besi ESEC2100sD 300mm die bonder
- 3LINTEC RAD-2510 F/12 Wafer Mounter 1 set, Vintage : 2026 New and unused
- 4NITTO DR8500-II Tape Laminator 2 sets
- 5K&S ConnX Elite Wire Bonder 5 set
AUTO TEST EQUIPMENT
- 1Teradyne NEXTEST Magnum 2 EV Tester 1 set
- 2RUDOLPH NSX320 Wafer inspection system 1 set
- 3Mi Equipment Mi20 Die sorter 1 set
- 4Mühlbauer DS-15000 Die sorter 6 set
- 5CREDENCE Fusion-MX Tester 1 set
WAFER FABRICATION
- 1NIKON NSR-S210D KrF Scanner/KrF Stepper
- 2ULVAC ei-7k or ei-5k Batch-type High Vacuum Evaporation System Model: ei
- 3DIC eFlow Anti-Static Defoamer
- 4PLATO 740-720*350 Manual Grinding and Polishing Machine
- 5TEL Tactras Vigus LK2 LK3 plasma etching
SURFACE MOUNT TECHNOLOGY
- 1KLA ICOS T890 Automatic Optical Inspection (AOI) machine
- 2PANASONIC CM202-DS chip mounter
- 3KLA TENCOR ICOS T890 automatic optical inspection machine
- 4HELLER 1809 EXL
- 5TRI TR7700 SII PLUS AOI 混合在線型自動光學檢測機
OTHERS
- 1ASM iDeal Mold 2G 软件要更新到跟3G iDeal mold 一样版本
- 2Nexcope Research Grade Upright Metallurgical Microscope NM900
- 3OPTORUN OTFC-1300 or OTFC-1550 Optical Thin Film Coater
- 4Hirata Industrial Robot AR-W180CL-4-T-330-M-AX4
- 5FE-SEM: HITACHI S-4800, or JEOL JSM-7001F/7100F, or FEI (Thermo Fisher) Sirion/Magellan