Dynamic MOS Technology’s
Equipment
LATEST NEWS
- 1TSK A-PM-60B Wafer Prober 1 set / DISCO DFG841 Wafer Grinder 2 sets / NITTO HR8500-II Tape remover 1 set / DISCO DFD6240 Auto Dicing Saw Machine 1 set / DISCO DAD3350 Auto Dicing Saw Machine 2 sets(4" 方盘 / 8" 圆盘) / DISCO DFD681 Auto Dicing Saw Machineset 4 sets / SHINKAWA SBB-1100Super Ball Placer 6 sets / SHINKAWA SFB-200 Flip Chip Bonder 18 sets / Panasonic FCX501 Flip Chip Bonder 14 sets / Panasonic MD-P200GGI Flip Chip Bonder 10 sets / ESPEC TSA-102ES-W Thermalshock Testing System 2 sets more....
- 2DISCO DFL7161 Laser Dicing Saw 1 set / TSK AD-3000T Dicing Saw 12 sets / LINTEC RAD-2500F/12RM Tape remover 1 set / LINTEC LTD-2500F/8 SA Wafer Mounter 2 sets / EFLOW 2AC-P104-02 Antistatic & foam remover 5 sets
- 3SPEEDFAM 32DPAW Single Side Grinder Polisher 1 set & SPEEDFAM 16B5L Double sided Grinder Polisher 1 set
- 4DISCO DFG8560 300mm wafer backside grinder 2 sets plus DGP8761 wafer backside grinder/polisher 1 set
- 5DISCO DFG8540 200mm wafer backside grinder
PACKAGING ASSEMBLY
- 1TSK A-PM-60B Wafer Prober 1 set / DISCO DFG841 Wafer Grinder 2 sets / NITTO HR8500-II Tape remover 1 set / DISCO DFD6240 Auto Dicing Saw Machine 1 set / DISCO DAD3350 Auto Dicing Saw Machine 2 sets(4" 方盘 / 8" 圆盘) / DISCO DFD681 Auto Dicing Saw Machineset 4 sets / SHINKAWA SBB-1100Super Ball Placer 6 sets / SHINKAWA SFB-200 Flip Chip Bonder 18 sets / Panasonic FCX501 Flip Chip Bonder 14 sets / Panasonic MD-P200GGI Flip Chip Bonder 10 sets / ESPEC TSA-102ES-W Thermalshock Testing System 2 sets more....
- 2DISCO DFL7161 Laser Dicing Saw 1 set / TSK AD-3000T Dicing Saw 12 sets / LINTEC RAD-2500F/12RM Tape remover 1 set / LINTEC LTD-2500F/8 SA Wafer Mounter 2 sets / EFLOW 2AC-P104-02 Antistatic & foam remover 5 sets
- 3SPEEDFAM 32DPAW Single Side Grinder Polisher 1 set & SPEEDFAM 16B5L Double sided Grinder Polisher 1 set
- 4DISCO DFG8560 300mm wafer backside grinder 2 sets plus DGP8761 wafer backside grinder/polisher 1 set
- 5DISCO DFG8540 200mm wafer backside grinder
AUTO TEST EQUIPMENT
- 1Advantest T5365 testing system
- 2EAGLETEST ETS-800 Tester 1 set
- 3Accretech TSK AP3000e 300mm wafer prober.
- 4ISMECA Handler 8 sets
- 5HONTECH HT-7048C Handler 1 set
WAFER FABRICATION
- 1AIXTRON CCS CRIUS MOCVD 1 set
- 2Looking for CELLO Ohmiker-60B Evaporator
- 3VEECO K465i MOCVD 2 sets (offer before 1/9 5:00PM if interested)
- 4SAMCO RIE-212IPC Etchers 6 sets / SAMCO RIE-330IPC Etchers 1 set / SAMCO PD-4800 PECVD System 2 sets
- 512 inch wafer fabrication eqipment list
SURFACE MOUNT TECHNOLOGY
- 1Assembleon AX-501 (TPR) Mounter 5 sets / Universal GC-30 Mounter 1 set / YAMAHA YG200 Mounter 2 sets / YAMAHA YV100-XG Mounter 4 sets / YAMAHA YV100-X Mounter 1 set / FUJI NXT Mounter 1 set / DEK HORIZON API Printer 4 sets / DEK HORIZON 02I Printer 3 sets / DEK HONIZON 03iX Printer 1 set / TRI TR7006L SPI 1 set / CYBER SE300 ULTRA SPI 6 sets / Cyber FLEX AOI 2 sets / Cyber FLEX 12 AOI 1 set / TRI TR7500 AOI 1 set / TRI TR7500 SII AOI 1 set / Vitronics XPM2-820 Reflow 3 sets / Vitronics MR1243+ Reflow 3 sets
- 2Yamaha chip mounter / screen printer 7 sets
- 3PSA Nitrogen Generator( 4x of 60m3 & 1x of 40m3)
- 4Accord 400 Cleaner 1 set
- 5Fuji XP142/XP143/XPF-S chip mounter 6 sets