Dynamic MOS Technology’s
Equipment
LATEST NEWS
- 1ASM Eagle Aero GoCu wire bonder
- 2DISCO DAG810 wafer grinder
- 3DISCO DFL7160 Laser Saw 3 sets / DATACON DS9-100 / DS9000e Sorter 4 sets / MIT M2 Die Sorter 2 sets / TOPCON VI-4302 Wafer Defect Inspection Machine 4 sets / VERIGY V101 Tester 15sets
- 4EVG 520 IS Wafer Bonding System
- 5Okamoto GNX200B wafer grinder
PACKAGING ASSEMBLY
- 1ASM Eagle Aero GoCu wire bonder
- 2DISCO DAG810 wafer grinder
- 3DISCO DFL7160 Laser Saw 3 sets / DATACON DS9-100 / DS9000e Sorter 4 sets / MIT M2 Die Sorter 2 sets / TOPCON VI-4302 Wafer Defect Inspection Machine 4 sets / VERIGY V101 Tester 15sets
- 4EVG 520 IS Wafer Bonding System
- 5Okamoto GNX200B wafer grinder
AUTO TEST EQUIPMENT
- 1ADVANTEST T6373 ND3 DDI tester 4 sets for sale
- 2Advantest T5588 memory testing system
- 3ADVANTEST M6751AD Tri temp handler 6 sets
- 4ADVANTEST M6741AD Tri temp handler 17 sets
- 5MIT CAERUS C320 / CAERUS C330 Die sorter 1 set each
WAFER FABRICATION
- 1Nuflare EBM-8000P/M Variable EB Mask Writer system
- 2WANTED Canon FPA5550iZ load port
- 3Wanted ZEISS Sigma300 FE-SEM
- 46 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 5Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets