Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1NITTO Denko MA2008IIV Full-auto Vacuum Wafer Mounter
- 2MITUTOYO QUICK VISION APEX dimension measurement
- 3DISCO DFG8540 200mm wafer grinder refurbished condition
- 4ASM Eagle Xpress GoCu wire bonder
- 5ASM Eagle Aero GoCu wire bonder
AUTO TEST EQUIPMENT
- 1SEIKO EPSON NS-8160MS high speed IC handler
- 2NIDEC ADVANCE R-786 High speed impedance meter
- 3TEL WDF8DP Dicing frame prober
- 4TEL WDF12DP+ Dicing frame prober
- 5Teradyne Integra Flex iFlex tester
WAFER FABRICATION
- 1WANTED Canon FPA5550iZ load port
- 2Wanted ZEISS Sigma300 FE-SEM
- 36 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
- 4Suss MicroTec SB8e, BA8, MA8BA8-Gen3 光罩對準曝光機/銲線機 3 台
- 5Panasonic PSX307 電漿清洗機