Dynamic MOS Technology’s
Equipment
LATEST NEWS
PACKAGING ASSEMBLY
- 1Microassembly Technologies MAT6400 die bonder
- 2DGP8760+DFM2700 inline wafer grinder
- 3DISCO DGP8761 研磨机 3 台, 单机版
- 4XYZ Condor100 bond tester
- 5封裝測試設備招標出售 K&S IConn 349 台, DISCO DFD6361 DFD6362, Hitachi CM700X, TOWA Y-1....
AUTO TEST EQUIPMENT
- 1ONTO Precisionpoint PRVX3 Probe Card Analyzer
- 2ACCRETECH TSK UF3000LX 300mm wafer prober
- 3YOKOGAWA ST6730 ST6730A ST6731A DDI tester
- 4SEIKO EPSON NS8106XS high speed IC handler
- 5SEIKO EPSON NS8106MS high speed IC handler
WAFER FABRICATION
- 1LED fab for sale list, 乾式蝕刻機/電漿光阻去除機/自動光阻塗佈機/測試機/劈裂機/電漿清洗機/點測機/拋光機...
- 2Nuflare EBM-8000P/M Variable EB Mask Writer system
- 3WANTED Canon FPA5550iZ load port
- 4Wanted ZEISS Sigma300 FE-SEM
- 56 inch wafer preparing line, SPEEDFAM, DAITO EMTEC
SURFACE MOUNT TECHNOLOGY