Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1ESEC2009SSI E die bonderSELL2025-11-13 13:23:302
- 2Wanted Hesse BJ931 wedge bonderBUY2025-11-13 12:01:033
- 3Okamoto GNX200 wafer back grinderSELL2025-11-13 11:53:192
- 4Wanted DISCO DAD3350 dicing sawBUY2025-11-13 11:52:013
- 5K&S AT-Premier wafer stub bumpSELL2025-11-13 11:32:4510
- 6DISCO DCS1440 spin cleaner with potion adding optionSELL2025-11-06 16:27:405
- 7ASM AD832i die bonderSELL2025-11-04 10:30:165
- 8ASM AD211 die bonder 2 setsSELL2025-11-04 09:47:592
- 9DISCO DAD3240 dicing saw 2 setSELL2025-11-01 08:24:332
- 10DISCO DFG841 wafer back griner for saleSELL2025-10-31 11:40:532
- 11DISCO DFG840 wafer back grinerSELL2025-10-31 10:27:501
- 12Wanted TOWA YPS2060 molding systemBUY2025-10-28 11:14:102
- 13Wanted ASM AD211 plus die bonderBUY2025-10-28 09:23:002
- 14ASM AD838L-G2 die bonderSELL2025-10-27 14:26:562
- 15NORDSON SONSCAN Fastline P300 Scanning Acoustic Microscope (SAM)SELL2025-10-26 09:51:341
- 16Wanted Alltec LC100 Laser Marking SystemBUY2025-10-26 09:07:121
- 17Wanted Takatori ATM-8200 wafer mounterBUY2025-10-26 09:03:001
- 18Renesas Hitachi CM-700H CM700H SIP mounter die bonderSELL2025-10-24 16:02:536
- 19Assembly/ATE equipment bidding from Taiwan fabSELL2025-10-24 14:35:50multiple
- 20Wanted NITTO DR8500-III tape laminatorBUY2025-10-24 14:23:541