Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1ESEC 2008/ ESEC2100 die bonder bonding force calibraiton kit 50NSELL2026-08-18 20:46:151
- 2ESEC 2100FC 固晶机 5 台SOLD2026-08-10 11:26:575
- 3日东 NITTO DR8500-II, DR8500-III, HR8500-II, HR8500-II UV 贴撕膜机 4 台SOLD2026-08-10 11:21:464
- 4博磊 Zenvoce ZVM-380 植球机 1 台SOLD2026-08-10 11:01:571
- 5Renesas CM-700X, ESEC 2100FC 固晶机 5 台SOLD2026-08-10 10:59:065
- 6一个 40呎 集装箱SOLD2026-08-10 10:43:471
- 7DATACON 2200evo 固晶机 1 台SOLD2026-08-10 10:37:401
- 8一个 20' 集装箱SOLD2026-08-10 10:24:351
- 9博磊 Zenvoce ZVM-380 植球机 1 台SOLD2026-08-10 10:17:451
- 10日东 NITTO DR3000-III 贴膜机 1 台SOLD2026-08-10 10:12:531
- 11TOWA Y-1 自动模压机 2 台SOLD2026-08-10 10:04:022
- 12DIC eFlow CO2 bubbler 4 setsSELL2026-07-31 09:51:574
- 13ASM Eagle Aero GoCu wire bonderSELL2026-07-27 16:12:235
- 14K&S Opto Lux wire bonderSELL2026-07-25 12:06:591
- 15K&S IConn ProCu Plus wire bonderSELL2026-07-25 12:05:462
- 16K&S IConn ProCu wire bonderSELL2026-07-25 12:04:221
- 17K&S IConn wire bonderSELL2026-07-25 12:01:491
- 18K&S AT-PREMIER wafer level ball bonderSELL2026-07-25 11:42:554
- 19DISCO DFD6361 300mm dicing sawSELL2026-07-23 14:20:162
- 20OKAMOTO GNX300 200/300mm wafer grinderSELL2026-07-21 15:13:151