DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / K&S IConn plus wire bonder
- ● FOR SELL / DISCO DFD6340 dicing saw 3 sets for bid
- ● FOR SELL / SYNAX SX2400 tri-temperature P/P handler
- ● FOR SELL / Advantest V93000 PS1600B ATH tester
- ● FOR SELL / TOWA Y1E 4120 auto molding system
- ● FOR SELL / Advantest Verigy PS1600B CTH tester
- ● FOR SELL / VERIGY V93000 PS400 STH tester
- ● 宜庭科技捐赠新台币2万元整支持海清'独居老人照顾方案'
- ● WANTED / Sonoscan SAT any model
- ● FOR SELL / ACCRETECH TSK UF2000 wafer prober
- ● FOR SELL / SEIKO EPSON NS-8160MS high speed IC handler
- ● FOR SELL / NIDEC ADVANCE R-786 High speed impedance meter
- ● FOR SELL / TEL WDF8DP Dicing frame prober
- ● FOR SELL / TEL WDF12DP+ Dicing frame prober
- ● FOR SELL / NITTO Denko MA2008IIV Full-auto Vacuum Wafer Mounter
- ● FOR SELL / Teradyne Integra Flex iFlex tester
- ● FOR SELL / MITUTOYO QUICK VISION APEX dimension measurement
- ● FOR SELL / DISCO DFG8540 200mm wafer grinder refurbished condition
- ● FOR SELL / ASM Eagle Xpress GoCu wire bonder
- ● FOR SELL / ASM Eagle Aero GoCu wire bonder
- ● FOR SELL / K&S IConn plus wire bonder
- ● FOR SELL / DISCO DFD6340 dicing saw 3 sets for bid
- ● FOR SELL / SYNAX SX2400 tri-temperature P/P handler
- ● FOR SELL / Advantest V93000 PS1600B ATH tester
- ● FOR SELL / TOWA Y1E 4120 auto molding system
- ● FOR SELL / Advantest Verigy PS1600B CTH tester
- ● FOR SELL / VERIGY V93000 PS400 STH tester
- ● 宜庭科技捐赠新台币2万元整支持海清'独居老人照顾方案'
- ● WANTED / Sonoscan SAT any model
- ● FOR SELL / ACCRETECH TSK UF2000 wafer prober
- ● FOR SELL / SEIKO EPSON NS-8160MS high speed IC handler
- ● FOR SELL / NIDEC ADVANCE R-786 High speed impedance meter
- ● FOR SELL / TEL WDF8DP Dicing frame prober
- ● FOR SELL / TEL WDF12DP+ Dicing frame prober
- ● FOR SELL / NITTO Denko MA2008IIV Full-auto Vacuum Wafer Mounter
- ● FOR SELL / Teradyne Integra Flex iFlex tester
- ● FOR SELL / MITUTOYO QUICK VISION APEX dimension measurement
- ● FOR SELL / DISCO DFG8540 200mm wafer grinder refurbished condition
- ● FOR SELL / ASM Eagle Xpress GoCu wire bonder
- ● FOR SELL / ASM Eagle Aero GoCu wire bonder
ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
INTRO/
WE ARE
SCROLL DOWN
SEE MORE
