Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1Microassembly Technologies MAT6400 die bonderSELL2026-05-14 09:51:321
- 2DGP8760+DFM2700 inline wafer grinderSELL2026-05-10 11:21:241
- 3DISCO DGP8761 研磨机 3 台, 单机版SELL2026-05-10 11:19:193
- 4XYZ Condor100 bond testerSELL2026-04-30 14:01:031
- 5封裝測試設備招標出售 K&S IConn 349 台, DISCO DFD6361 DFD6362, Hitachi CM700X, TOWA Y-1....SELL2026-04-30 09:22:27multiple
- 6ESPEC EHS431 HASTBUY2026-04-18 15:58:442
- 7BESI FICO AMS-LM auto molding systemBUY2026-04-18 15:50:132
- 8EO BMC204P laser driller for POPSELL2026-04-17 15:18:501
- 9精映科技 Avvatech HERMES EC230E C02 bubblerSELL2026-04-17 15:15:143
- 10MRSI HVM high volume die bonderBUY2026-04-14 08:55:322
- 11ASM AB530 wedge bonderSELL2026-04-14 08:50:4130
- 12K&S AT-Premier stud bumping bonderSELL2026-04-13 14:29:2310
- 13DISCO DFD6362 300mm dicing saw brand new 5 setsSELL2026-04-11 10:54:345
- 14ASM Eagle Aero GoCu wire bonder 2022 vintageSELL2026-03-30 11:42:372
- 15VEECO Optimus ASD-800 dicing sawSELL2026-03-26 09:15:051
- 16NOMURA Super Bubbler-3 CO2 bubblerSELL2026-03-23 16:27:206
- 17DISCO DFD6340 dicing sawSELL2026-03-23 16:20:121
- 18DSICO DFD6350 dicing sawSELL2026-03-14 10:48:051
- 19ASM Eagle Aero GoCu wire bonderSELL2026-03-12 13:47:235
- 20DISCO DAG810 wafer grinderSELL2026-03-12 08:54:401