Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1ESEC 2100FC Die bonder 5 setsSOLD2026-08-10 11:26:575
- 2NITTO DR8500-II, DR8500-III, HR8500-II, HR8500-II UV Tape Detaper 4 setSOLD2026-08-10 11:21:464
- 3Zen voce ZVM-380 Ball Placer 1 setSOLD2026-08-10 11:01:571
- 4Die bonder Renesas CM-700X, ESEC 2100FC 5 setsSOLD2026-08-10 10:59:065
- 5one 40-foot containerSOLD2026-08-10 10:43:471
- 6DATACON 2200evo die bonder 1 setSOLD2026-08-10 10:37:401
- 7one 20-foot containerSOLD2026-08-10 10:24:351
- 8Zen voce ZVM-380 Ball Placer 1 setSOLD2026-08-10 10:17:451
- 9NITTO DR3000-III Tape Laminator 1 setsSOLD2026-08-10 10:12:531
- 10TOWA Y-1 auto molding system 2 setsSOLD2026-08-10 10:04:022
- 11DIC eFlow CO2 bubbler 4 setsSELL2026-07-31 09:51:574
- 12ASM Eagle Aero GoCu wire bonderSELL2026-07-27 16:12:235
- 13K&S Opto Lux wire bonderSELL2026-07-25 12:06:591
- 14K&S IConn ProCu Plus wire bonderSELL2026-07-25 12:05:462
- 15K&S IConn ProCu wire bonderSELL2026-07-25 12:04:221
- 16K&S IConn wire bonderSELL2026-07-25 12:01:491
- 17K&S AT-PREMIER wafer level ball bonderSELL2026-07-25 11:42:554
- 18DISCO DFD6361 300mm dicing sawSELL2026-07-23 14:20:162
- 19OKAMOTO GNX300 200/300mm wafer grinderSELL2026-07-21 15:13:151
- 20BESI Datacon 2200evo GEN3 die bonderSELL2026-07-16 16:34:371