Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1DISCO DFD6560 dicing sawSELL2025-10-02 10:41:321
- 2Wanted ASM MCM-12 multi chip die bonderBUY2025-09-08 10:48:431
- 3Wanted FiconTEC AL300 AL500 AL12000BUY2025-09-08 10:46:135
- 4Wanted Shibaura TFC-3000/3200 inner lead bonderBUY2025-09-08 10:44:431
- 5DISCO DFL7341 stealth saw for mems waferSELL2025-09-06 18:57:011
- 6Wanted Olympus SZ61 microscope 45 degree or 60 degree 100 eachBUY2025-09-06 18:43:34100
- 7K&S AT-Premier plus wafer bonderSELL2025-09-02 09:50:541
- 8DISCO DFD6361 300mm wafer sawSELL2025-09-02 09:49:052
- 9HESSE BondjetT BJ939 heavy wedge wire bonderSELL2025-09-01 08:35:028
- 10ASM AB383 wire bonderSELL2025-08-28 17:03:1313
- 11K&S Rapid wire bonderSELL2025-08-28 17:02:122
- 12ASM AD832i die bonderSELL2025-08-28 17:01:232
- 13TOWA Y1E4120 auto molding systemSELL2025-08-28 16:58:231
- 14ASM die bonder / wire bonder 2x 40' HQ containersSOLD2025-08-26 11:38:401 lot
- 15Shibaura TFC-3000/3200 Inner lead bonder 8 sets, SEC potting system 15 setsSOLD2025-08-26 11:22:061 lot
- 16oven 1 setSOLD2025-08-26 11:11:261
- 17NITTO MSA840 wafer mounterSOLD2025-08-26 09:55:461
- 18DISCO DFD6361 300mm dicing saw, microscope 4xSOLD2025-08-26 09:36:385
- 19DISCO DFP8140 Wafer PolisherSELL2025-08-24 10:51:181
- 20K&S AT-Premier Plus wafer level bonderSELL2025-08-15 08:36:555