Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1EVG 520 IS Wafer Bonding SystemBUY2026-03-10 13:49:231
- 2Okamoto GNX200B wafer grinderBUY2026-03-08 14:16:391
- 3松下 PANASONIC PSX307-M 等离子清洗机 (M type, 大腔体)BUY2026-02-03 16:53:561
- 4DISCO DAD3350 全自动划片机 2 台BUY2026-02-03 16:50:172
- 5DISCO DFD6361 全自动划片机 2 台BUY2026-02-03 16:42:032
- 6DISCO DGP8760+DFM2700 连线研磨/抛光/贴片一体机BUY2026-02-03 16:09:071
- 7Sonoscan SAT any modelBUY2026-01-07 09:24:322
- 8Wanted K&S RAPID wire bonderBUY2025-12-12 20:41:21100
- 9Wanted Hitachi SU5000 Field Emission Scanning Electron Microscope (SEM)BUY2025-12-10 15:52:021
- 10Wanted FICO AMS-W auto molding system 2 setsBUY2025-12-09 14:38:242
- 11Wanted Shinkawa UTC-100 wire bonderBUY2025-12-09 14:22:322
- 12Wanted Panasonic PSX307-M NM-EFP1A plasma cleanerBUY2025-12-09 14:19:541
- 13Wanted Hesse BJ931 wedge bonderBUY2025-11-13 12:01:033
- 14Wanted DISCO DAD3350 dicing sawBUY2025-11-13 11:52:013
- 15Wanted TOWA YPS2060 molding systemBUY2025-10-28 11:14:102
- 16Wanted ASM AD211 plus die bonderBUY2025-10-28 09:23:002
- 17Wanted Alltec LC100 Laser Marking SystemBUY2025-10-26 09:07:121
- 18Wanted Takatori ATM-8200 wafer mounterBUY2025-10-26 09:03:001
- 19Wanted NITTO DR8500-III tape laminatorBUY2025-10-24 14:23:541
- 20Wanted MIT Optimus2 die sorterBUY2025-10-23 11:05:581