DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / K&S AT-Premier plus wafer bonder
- ● FOR SELL / DISCO DFD6361 300mm wafer saw
- ● FOR SELL / HESSE BondjetT BJ939 heavy wedge wire bonder
- ● FOR SELL / ASM AB383 wire bonder
- ● FOR SELL / K&S Rapid wire bonder
- ● FOR SELL / ASM AD832i die bonder
- ● FOR SELL / Accretech TSK UF2000 wafer prober
- ● FOR SELL / Accretech TSK UF200R wafer prober
- ● FOR SELL / TOWA Y1E4120 auto molding system
- ● FOR SELL / AccoTest STS8200 tester
- ● 感謝力樂芯微電子有限公司 李光奎 總經理 於丹納斯颱風捐款台幣20,000元 ,贊助與支持籌備救援物資。
- ● SOLD / ASM die bonder / wire bonder 2x 40' HQ containers
- ● SOLD / spare parts for FICO auto molding system 1 lot
- ● SOLD / Shibaura TFC-3000/3200 Inner lead bonder 8 sets, SEC potting system 15 sets
- ● SOLD / KLA TENCOR ICOS CI-T130 component inspection system
- ● SOLD / oven 1 set
- ● SOLD / Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- ● SOLD / NITTO MSA840 wafer mounter
- ● SOLD / ISMECA NX16/NX116 bowl feed handler 7 sets
- ● SOLD / DISCO DFD6361 300mm dicing saw, microscope 4x
- ● FOR SELL / K&S AT-Premier plus wafer bonder
- ● FOR SELL / DISCO DFD6361 300mm wafer saw
- ● FOR SELL / HESSE BondjetT BJ939 heavy wedge wire bonder
- ● FOR SELL / ASM AB383 wire bonder
- ● FOR SELL / K&S Rapid wire bonder
- ● FOR SELL / ASM AD832i die bonder
- ● FOR SELL / Accretech TSK UF2000 wafer prober
- ● FOR SELL / Accretech TSK UF200R wafer prober
- ● FOR SELL / TOWA Y1E4120 auto molding system
- ● FOR SELL / AccoTest STS8200 tester
- ● 感謝力樂芯微電子有限公司 李光奎 總經理 於丹納斯颱風捐款台幣20,000元 ,贊助與支持籌備救援物資。
- ● SOLD / ASM die bonder / wire bonder 2x 40' HQ containers
- ● SOLD / spare parts for FICO auto molding system 1 lot
- ● SOLD / Shibaura TFC-3000/3200 Inner lead bonder 8 sets, SEC potting system 15 sets
- ● SOLD / KLA TENCOR ICOS CI-T130 component inspection system
- ● SOLD / oven 1 set
- ● SOLD / Suss MicroTec aligner/bonder SB8e, BA8, MA8BA8-Gen3 3 sets
- ● SOLD / NITTO MSA840 wafer mounter
- ● SOLD / ISMECA NX16/NX116 bowl feed handler 7 sets
- ● SOLD / DISCO DFD6361 300mm dicing saw, microscope 4x


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
INTRO/
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