DYNAMIC MOS
TECHNOLOGY CO., LTD
( NEWS )
- ● FOR SELL / DISCO DFG841 wafer back grinder
- ● FOR SELL / Accretech TSK UF2000 wafer prober
- ● SOLD / manual test station for down grade flash device 80 sets
- ● SOLD / TOWA FMS3040 jig saw 1 set
- ● SOLD / FICO auto molding system driver and controller 1 lot
- ● SOLD / NIKON OLYMPUS microscope 3 sets
- ● SOLD / Takatori ATM-1100EF tape laminator 2 sets
- ● SOLD / MUHLBAUER DS-20000 Die sorter
- ● SOLD / ASM AB838L die bonder
- ● SOLD / Fasford DB830plus+ 300mm die bonder 2 sets
- ● DMT charity donates 44 pcs used Metal storage shelves to support poor families.
- ● FOR SELL / 睿智 Wisdom HTLH-UV5-A laser marking system
- ● FOR SELL / 睿智 Wisdom DLS1-SP15W UV laser cutting system
- ● SOLD / NIKON NWL860+L200 microscope with auto loader
- ● SOLD / table top microscope 38 sets
- ● SOLD / Advantest T5375 memory tester 3 sets
- ● SOLD / 1x40' semiconductor equipments
- ● SOLD / Renesas CM-700H die bonder 3x
- ● SOLD / ASM ISLinDA 300mm die bonder 2x, Twin Eagle Xtreme dual head wire bonder 2x, APT pressure oven 1x, storage tank 3x
- ● FOR SELL / FEI Strata DB235 Focused Ion-Beam Dual-Beam
- ● FOR SELL / DISCO DFG841 wafer back grinder
- ● FOR SELL / Accretech TSK UF2000 wafer prober
- ● SOLD / manual test station for down grade flash device 80 sets
- ● SOLD / TOWA FMS3040 jig saw 1 set
- ● SOLD / FICO auto molding system driver and controller 1 lot
- ● SOLD / NIKON OLYMPUS microscope 3 sets
- ● SOLD / Takatori ATM-1100EF tape laminator 2 sets
- ● SOLD / MUHLBAUER DS-20000 Die sorter
- ● SOLD / ASM AB838L die bonder
- ● SOLD / Fasford DB830plus+ 300mm die bonder 2 sets
- ● DMT charity donates 44 pcs used Metal storage shelves to support poor families.
- ● FOR SELL / 睿智 Wisdom HTLH-UV5-A laser marking system
- ● FOR SELL / 睿智 Wisdom DLS1-SP15W UV laser cutting system
- ● SOLD / NIKON NWL860+L200 microscope with auto loader
- ● SOLD / table top microscope 38 sets
- ● SOLD / Advantest T5375 memory tester 3 sets
- ● SOLD / 1x40' semiconductor equipments
- ● SOLD / Renesas CM-700H die bonder 3x
- ● SOLD / ASM ISLinDA 300mm die bonder 2x, Twin Eagle Xtreme dual head wire bonder 2x, APT pressure oven 1x, storage tank 3x
- ● FOR SELL / FEI Strata DB235 Focused Ion-Beam Dual-Beam


ABOUT/
OUR VALUE
Dynamic MOS Technology was established in 2003
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
for the purpose of providing used semiconductor equipments
to many of the leading semiconductor companies worldwide.
2003since.
OUR VALUE
Dynamic MOS Technology was
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
established in 2003 for the purpose
of providing used semiconductor equipments
to many of the leading semiconductor
companies worldwide.
2003since.
INTRO/
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