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Copyright © DYNAMIC MOS TECHNOLOGY
CO., LTD.All Rights Reserved.
SELL | TSK PG300RM Wafer Grinder 1 set / DISCO DFD6361 Dicing Saw 4 sets / SHINKAWA SPA-400 Die Bonder 32 sets / K&S Maxum Ultra Wire Bonder 11 sets / SHINKAWA UTC-3000 Wire Bonder 59 sets / DATACON 8800FCQUANTUM Die Bonder 3 sets / TOWA KPS-60V Auto Mold System 3 sets / TOWA PMC 1040-D Auto Mold System 1 set / TOWA PMC 1040-D-2M Auto Mold System 2 sets / HANMI 3000D+SECRON SW5000 Handler 3 sets / Verigy V93000 Tester 1 set / HITACHI CM700 Die Bonder 1 set / PHILIPS/ASSEMBLEON AX301 AX-301 Wafer Mounter 1 set / FUJI NXTIII Wafer Mounter 1 set / FUJI NXT-H Wafer Mounter 1 set / NXT2000-AM Inspection machine 1 set (offer before 1/7 5:00PM if interested)
PKG
UPDATE / 2024-12-31 14:58:12
Assembly equipment list for sale, please refer to the tool list in below picture if you are interested.
TSK PG300RM Wafer Grinder 1 set
DISCO DFD6361 Dicing Saw 4 sets
SHINKAWA SPA-400 Die Bonder 32 sets
K&S Maxum Ultra Wire Bonder 11 sets
SHINKAWA UTC-3000 Wire Bonder 59 sets
DATACON 8800FCQUANTUM Die Bonder 3 sets
TOWA KPS-60V Auto Mold System 3 sets
TOWA PMC 1040-D Auto Mold System 1 set
TOWA PMC 1040-D-2M Auto Mold System 2 sets
HANMI 3000D+SECRON SW5000 Handler 3 sets
Verigy V93000 Tester 1 set
HITACHI CM700 Die Bonder 1 set
PHILIPS/ASSEMBLEON AX301 AX-301 Wafer Mounter 1 set
FUJI NXTIII Wafer Mounter 1 set
FUJI NXT-H Wafer Mounter 1 set
NXT2000-AM Inspection machine 1 set
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