Assembly equipment list for sale, please refer to the tool list in below picture if you are interested.
TSK A-PM-60B Wafer Prober 1 set
DISCO DFG841 Wafer Grinder 2 sets
NITTO HR8500-II Tape remover 1 set
DISCO DFD6240 Auto Dicing Saw Machine 1 set
DISCO DAD3350 Auto Dicing Saw Machine 2 sets(4" 方盘 / 8" 圆盘)
DISCO DFD681 Auto Dicing Saw Machineset 4 sets
SHINKAWA SBB-1100Super Ball Placer 6 sets
SHINKAWA SFB-200 Flip Chip Bonder 18 sets
Panasonic FCX501 Flip Chip Bonder 14 sets
Panasonic MD-P200GGI Flip Chip Bonder 10 sets
ESPEC TSA-102ES-W Thermalshock Testing System 2 sets
more....