Assembly equipment list for sale, please refer to the tool list in below if you are interested. Please submit your bids by close of business on Monday, Nov 9.
The key projects are as follows:
DISCO DFL7361 Dicing Saw 1 set
DISCO DGP8761 Wafer Grinder 1 set
DISCO DGP8760 Wafer Grinder 3 sets
LINTEC RAD-2510F/12 Die Bonder 1 set
LINTEC RAD-2700F/12 Die Bonder 3 sets
DISCO DFD6340+HANMI 3800L Saw and singulation machine 5 sets
HITACHI DB-700AD Die Bonder 10 sets
TOWA Y1E3120 Mold 1 set
TOWA Y1E Mold 1 set
FICO AMS-LM60-306 Mold 1 set
PANASONIC PSX307A Plasma cleaning system 1 set
SHINKAWA UTC-2000S Wire Bonder 40 sets
SHINKAWA UTC-3000 Wire Bonder 89 sets
TSK AWD-300TX Dicing Saw 1 set
CLARE CT-C82 Laser marker 2 sets
C SUN MOL-2DS Oven 1 set
1GOH-1MX6 N2 Oven 5 sets
AURIGIN AU-800 Ball Placer 1 set
CYBER CT300 Laser Surface Metrology System 1 set
HV-338S2 Ultra sonic Magazine Cleaner 2 sets
GMM SU30 Laser marker 2 sets