DISCO DFG850 Wafer Grinder 2 sets / TSK PG200RM Wafer Grinder 1 set / NITTO DR8500-II Tape Laminator 1 set / NITTO HR8500-II Tape remover 1 set / NITTO HR9300 Tape remover 1 set / TSK UF200 Wafer Prober 2 sets / DATACON 2200APM Die Bonder 1 set | 宜庭科技有限公司 Dynamic MOS Technology Co., Ltd.

SELL | DISCO DFG850 Wafer Grinder 2 sets / TSK PG200RM Wafer Grinder 1 set / NITTO DR8500-II Tape Laminator 1 set / NITTO HR8500-II Tape remover 1 set / NITTO HR9300 Tape remover 1 set / TSK UF200 Wafer Prober 2 sets / DATACON 2200APM Die Bonder 1 set

PKG

UPDATE / 2024-02-15 14:35:47

VINTAGE Inquiry.
CONDITION Inquiry.
LOCATIONEurope bidding.

Assembly equipment list for sale, please refer to the tool list in below picture if you are interested.
DISCO DFG850 Wafer Grinder 2 sets
TSK PG200RM Wafer Grinder 1 set
NITTO DR8500-II Tape Laminator 1 set
NITTO HR8500-II Tape remover 1 set
NITTO HR9300 Tape remover 1 set
TSK UF200 Wafer Prober 2 sets
DATACON 2200APM Die Bonder 1 set