BESI Datacon 2200 evo Die Bonder 1 set / BESi ESEC 2007 SSI Plus Die Bonder 1 set / BESI ESEC 2008xP Die Bonder 1 set / Shinkawa UTC2000 Wire Bonder 1 set / Shinkawa UTC2000 Wire Bonder 1 set / ASM Xpress GoCu Wire Bonder 1 set / ASM IHAWK XPRESS GOCU Wire Bonder 1 set | 宜庭科技有限公司 Dynamic MOS Technology Co., Ltd.

SELL | BESI Datacon 2200 evo Die Bonder 1 set / BESi ESEC 2007 SSI Plus Die Bonder 1 set / BESI ESEC 2008xP Die Bonder 1 set / Shinkawa UTC2000 Wire Bonder 1 set / Shinkawa UTC2000 Wire Bonder 1 set / ASM Xpress GoCu Wire Bonder 1 set / ASM IHAWK XPRESS GOCU Wire Bonder 1 set

PKG

UPDATE / 2024-02-20 09:34:20

VINTAGEInquiry.
CONDITIONWorking.
LOCATION Asia.

Assembly equipment list for sale, please refer to the tool list in below if you are interested.
BESI Datacon 2200 evo Die Bonder 1 set
BESi ESEC 2007 SSI Plus Die Bonder 1 set
BESI ESEC 2008xP Die Bonder 1 set
Shinkawa UTC2000 Wire Bonder 1 set
Shinkawa UTC2000 Wire Bonder 1 set
ASM Xpress GoCu Wire Bonder 1 set
ASM IHAWK XPRESS GOCU Wire Bonder 1 set