Dynamic MOS Technology’s
Equipment
- 項目
- 狀態
- 1台湾厂家 出售 要卖 设备清单 DISCO K&S LINTEC HITACHI TSK...SELL2024-11-22 18:12:5050
- 2DISCO DFD6362 Dicing Saw 1 setSELL2024-11-21 15:27:371
- 3Mini LED equipment list for sale(ASM AD420XL AD420 VORTEX Die Bonder 18 sets / HAD8635 Die Bonder 2 sets, more....)SELL2024-11-15 15:16:291 lot
- 4UNIVERSAL FuzionSC1-11 Wafer Mounter (offer before 11/18 5:00PM if interested)SELL2024-11-15 14:49:113
- 5TAKATORI ATRM-2100D tape removerSELL2024-11-14 12:08:331
- 6TAKATORI ATM-1100EF tape laminatorSELL2024-11-14 12:05:322
- 7NITTO DR3000-III 300mm tape laminatorSELL2024-11-14 12:02:591
- 8YAMADA G-LINE Auto Mold System 1 setSELL2024-10-25 14:16:231
- 9HESSE BJ820 Al Wire Bonder 10 setsSELL2024-10-22 11:57:5510
- 10DISCO DFD6341 wafer dicing sawSELL2024-10-20 13:17:211
- 11ACCRETECH AD-3000T Plus 300mm wafer dicing sawSELL2024-10-20 13:15:401
- 12TOWA PMC2030-D auto molding systemSELL2024-10-20 13:02:551
- 13ASM AD8312 Plus 300mm die bonderSELL2024-10-20 12:56:4019
- 14VITROX TH3000i component inspector lead scanner AOISELL2024-10-20 12:53:322
- 15YAMADA G-LINE Auto Mold System 1 setSELL2024-10-18 10:41:111
- 16ASM MCM12 multi chip die bonderSELL2024-10-14 17:20:211
- 17K&S IConn / Maxum Ultra / Maxum Plus Wire Bonder / YAMAHA IPULSE M4A Wafer Mounter / JUKI KE-750 Wafer Mounter / DATACON DS9000 Die sorterSELL2024-10-08 10:37:551 lot
- 18ACCRETECH TOSEI W-GM-4250 Wafer Edge Grinding Machine 1 set / TAKATORI MWS-610SD Dicing Saw 1 set / SPEEDFAM 32DPAW Wafer Grinder 1 set / SPEEDFAM 16B5L Wafer Grinder 1 setSELL2024-10-07 15:02:071 lot
- 19DISCO DAD321 Dicing Saw 4 setsSELL2024-10-04 14:39:184
- 20DISCO DFD6340 wafer dicing sawSELL2024-10-03 10:42:003